SEARAY™ High-Density Arrays Maximize Routing and Grounding Flexibility
These high speeds, high density open-pin-field arrays (SEAM, SEAF), on a 1.27 mm pitch grid, and allow maximum grounding and routing flexibility.
Interconnect systems are available with up to 560 single-ended I/Os or 140 differential pairs, and in stack heights from 7 to 40 mm. The rugged Edge Rate® contact system is less prone to damage when “zippered” during unmating.
SEARAY is available in parallel, perpendicular (right angle), and coplanar (horizontal) orientations. Solder charges are standard on each tail for ease of processing, to create IPC-A-610F and IPC J-STD-001F Class 3 solder joints. Press-fit tails are also available.
High-speed cable assemblies for 50 Ω or 100 Ω solutions are available. VITA Standards specify configurations of SEARAY high-speed array products for VITA 57.1, VITA 57.4, and VITA 74.